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计算机专业术语(二)

  TAP(Test Access Port,测试存取端口)
  TBGA(Tie Ball Grid Array,带状球形光栅阵列)
  TCP:Tape Carrier Package(薄膜封装),发热小
  TDP(Thermal Design Power,热量设计功率)
  Throughput(吞吐量)
  TLB(Translate Look side Buffers,转换旁视缓冲器)
  TLP(Thread-Level Parallelism,线程级并行)
  TMP(Threaded Multi-Path,线程多通道)
  TPI(True Performance Initiative/index,真实性能为先/指标)
  TQFP(Thin Plastic Quad Flat Pack,薄型方面平面封装)
  Trc(Row Cycle Time,列循环时间)
  TrD(Transistor Density,晶体管密度)
  TSOP(Thin Small Outline Plastic,薄型小型塑料)
  USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)
  VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)
  VFSD(Vertex Frequency Stream Divider,顶点频率流分隔)
  VID(VID:Voltage identify,电压鉴别号码)
  VLIW(Very Long Instruction Word,超长指令字)
  VPU(Vector Permutate Unit,向量排列单元)
  VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
  VSA(Virtual System Architecture,虚拟系统架构)
  VTF(VIA Technical Forum,威盛技术论坛)
  XBar(Crossbar,交叉口闩仲载逻辑单元)
  XP(Experience,体验)
  XP(Extra performance,额外性能)
  XP(eXtreme Performance,极速性能)
  散热器
  TFT(Tiny Fin Technology,微型鳍片技术)
  
  2、主板
  3GIO(Third Generation Input/Output,第三代输入输出技术)
  ACR(Advanced Communications Riser,高级通讯升级卡)
  ADIMM(advanced Dual In-line Memory Modules,高级双重内嵌式内存模块)
  AGTL+(Assisted Gunning Transceiver Logic,援助发射接收逻辑电路)
  AIMM(AGP Inline Memory Module,AGP板上内存升级模块)
  AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
  AHA(Accelerated Hub Architecture,加速中心架构)
  AOI(Automatic Optical Inspection,自动光学检验)
  APU(Audio Processing Unit,音频处理单元)
  ARF(Asynchronous Receive FIFO,异步接收先入先出)
  ASF(Alert Standards Forum,警告标准讨论)
  ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
  AT(Advanced Technology,先进技术)
  ATX(AT Extend,扩展型AT)
  BIOS(Basic Input/Output System,基本输入/输出系统)
  CNR(Communication and Networking Riser,通讯和网络升级卡)
  CSA(Communication Streaming Architecture,通讯流架构)
  CSE(Configuration Space Enable,可分配空间)
  COAST(Cache-on-a-stick,条状缓存)
  DASP(Dynamic Adaptive Speculative Pre-Processor,动态适应预测预处理器)
  DB:Device Bay,设备插架
  DMI(Desktop Management Interface,桌面管理接口)
  DOT(Dynamic Overclocking Technonlogy,动态超频技术)
  DPP(direct print Protocol,直接打印协议
  DRCG(Direct Rambus clock generator,直接RAMBUS时钟发生器)
  DVMT(Dynamic Video Memory Technology,动态视频内存技术)
  E(Economy,经济,或Entry-level,入门级)
  EB(Expansion Bus,扩展总线)
  EFI(Extensible Firmware Interface,扩展固件接口)
  EHCI(Enhanced Host Controller Interface,加强型主机端控制接口)
  EISA(Enhanced Industry Standard Architecture,增强形工业标准架构)
  EMI(Electromagnetic Interference,电磁干扰)
  ESCD(Extended System Configuration Data,可扩展系统配置数据)
  ESR(Equivalent Series Resistance,等价系列电阻)
  FBC(Frame Buffer Cache,帧缓冲缓存)
  FireWire(火线,即IEEE1394标准)
  FlexATX(Flexibility ATX,可扩展性ATX)
  FSB(Front Side Bus,前端总线)
  FWH(Firmware Hub,固件中心)
  GB(Garibaldi架构,Garibaldi基于ATX架构,但是也能够使用WTX构架的机箱)
  GMCH(Graphics&Memory Controller Hub,图形和内存控制中心)
  GPA(Graphics Performance Accelerator,图形性能加速卡)
  GPIs(General Purpose Inputs,普通操作输入)
  GTL+(Gunning Transceiver Logic,发射接收逻辑电路)
  HDIT(High Bandwidth Differential Interconnect Technology,高带宽微分互连技术)
  HSLB(High Speed Link Bus,高速链路总线)
  HT(HyperTransport,超级传输)
  I2C(Inter-IC)
  I2C(Inter-Integrated Circuit,内置集成电路)
  IBASES(Intel Baseline AGP System Evaluation Suite,英特尔基线AGP系统评估套件)
  IC(integrate circuit,集成电路)
  ICH(Input/Output Controller Hub,输入/输出控制中心)
  ICH-S(ICH-Hance Rapids,ICH高速型)
  ICP(Integrated Communications Processor,整合型通讯处理器)
  IHA(Intel Hub Architecture,英特尔Hub架构)
  IMB(Inter Module Bus,隐藏模块总线)
  INTIN(Interrupt Inputs,中断输入)
  IPMAT(Intel Power Management Analysis Tool,英特尔能源管理分析工具)
  IR(infrared ray,红外线)
  IrDA(infrared ray,红外线通信接口,可进行局域网存取和文件共享)
  ISA(Industry Standard Architecture,工业标准架构)
  ISA(instruction set architecture,工业设置架构)
  K8HTB(K8 HyperTransport Bridge,K8闪电传输桥)
  LSI(Large Scale Integration,大规模集成电路)
  LPC(Low Pin Count,少针脚型接口)
  MAC(Media Access Controller,媒体存储控制器)
  MBA(manage boot agent,管理启动代理)
  MC(Memory Controller,内存控制器)
  MCA(Micro Channel Architecture,微通道架构)
  MCH(Memory Controller Hub,内存控制中心)
  MDC(Mobile Daughter Card,移动式子卡)
  MII(Media Independent Interface,媒体独立接口)
  MIO(Media I/O,媒体输入/输出单元)
  MOSFET(metallic oxide semiconductor field effecttransistor,金属氧化物半导体场
  效应晶体管)
  MRH-R(Memory Repeater Hub,内存数据处理中心)
  MRH-S(SDRAM Repeater Hub,SDRAM数据处理中心)
  MRIMM(Media-RIMM,媒体RIMM扩展槽)
  MSI(Message Signaled Interrupt,信息信号中断)
  MSPCE(Multiple Streams with Pipelining and Concurrent Execution,多重数据流
  的流水线式传输与并发执行)
  MT=MegaTransfers(兆传输率)
  MTH(Memory Transfer Hub,内存转换中心)
  MuTIOL(Multi-Threaded I/O link,多线程I/O链路)
  NGIO(Next Generation Input/Output,新一代输入/输出标准)
  NPPA(nForce Platform Processor Architecture,nForce平台处理架构)
  
  
  OHCI(Open Host Controller Interface,开放式主控制器接口)
  ORB(operation request block,操作请求块)
  ORS(Over Reflow Soldering,再流回焊接,SMT元件的焊接方式)
  P64H(64-bit PCI Controller Hub,64位PCI控制中心)
  PCB(printed circuit board,印刷电路板)
  PCBA(Printed Circuit Board Assembly,印刷电路板装配)
  PCI(Peripheral Component Interconnect,互连外围设备)
  PCI SIG(Peripheral Component Interconnect Special Interest Group,互连外
  围设备专业组)
  PDD(Performance Driven Design,性能驱动设计)
  PHY(Port Physical Layer,端口物理层)
  POST(Power On Self Test,加电自测试)
  PS/2(Personal System 2,第二代个人系统)
  PTH(Plated-Through-Hole technology,镀通孔技术)
  RE(Read Enable,可读取)
  QP(Quad-Pumped,四倍泵)
  RBB(Rapid BIOS Boot,快速BIOS启动)
  RNG(Random number Generator,随机数字发生器)
  RTC(Real Time Clock,实时时钟)
  KBC(KeyBroad Control,键盘控制器)
  SAP(Sideband Address Port,边带寻址端口)
  SBA(Side Band Addressing,边带寻址)
  SBC(single board computer,单板计算机)
  SBP-2(serial bus protocol 2,第二代串行总线协协)
  SCI(Serial Communications Interface,串行通讯接口)
  SCK(CMOS clock,CMOS时钟)
  SDU(segment data unit,分段数据单元)
  SFF(Small Form Factor,小尺寸架构)
  SFS(Stepless Frequency Selection,步进频率选项)
  SMA(Share Memory Architecture,共享内存结构)
  SMT(Surface Mounted Technology,表面黏贴式封装)
  SPI(Serial Peripheral Interface,串行外围设备接口)
  SSLL(Single Stream with Low Latency,低延迟的单独数据流传输)
  STD(Suspend To Disk,磁盘唤醒)
  STR(Suspend To RAM,内存唤醒)
  SVR(Switching Voltage Regulator,交换式电压调节)
  THT(Through Hole Technology,插入式封装技术)
  UCHI(Universal Host Controller Interface,通用宿主控制器接口)
  UPA(Universal Platform Architecture,统一平台架构)
  UPDG(Universal Platform Design Guide,统一平台设计导刊)
  USART(Universal Synchronous Asynchronous Receiver Transmitter,通用同步非同步
  接收传送器)
  USB(Universal Serial Bus,通用串行总线)
  USDM(Unified System Diagnostic Manager,统一系统监测管理器)
  VID(Voltage Identification Definition,电压识别认证)
  VLB(Video Electronics Standards Association Local Bus,视频电子标准协会局域总线)
  VLSI(Very Large Scale Integration,超大规模集成电路)
  VMAP(VIA Modular Architecture Platforms,VIA模块架构平台)
  VSB(V Standby,待命电压)
  VXB(Virtual Extended Bus,虚拟扩展总线)
  VRM(Voltage Regulator Module,电压调整模块)
  WE(Write Enalbe,可写入)
  WS(Wave Soldering,波峰焊接,THT元件的焊接方式)
  XT(Extended Technology,扩充技术)
  ZIF(Zero Insertion Force,零插力插座)
  
  芯片组
  ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
  AGP(Accelerated Graphics Port,图形加速接口)
  BMS(Blue Magic Slot,蓝色魔法槽)
  I/O(Input/Output,输入/输出)
  MIOC:Memory and I/O Bridge Controller,内存和I/O桥控制器
  NBC:North Bridge Chip(北桥芯片)
  PIIX:PCI ISA/IDE Accelerator(加速器)
  PSE36:Page Size Extension 36-bit,36位页面尺寸扩展模式
  PXB:PCI Expander Bridge,PCI增强桥
  RCG:RAS/CAS Generator,RAS/CAS发生器
  SBC:South Bridge Chip(南桥芯片)
  SMB(System Management Bus,全系统管理总线)
  SPD(Serial Presence Detect,连续存在检测装置)
  SSB:Super South Bridge,超级南桥芯片
  TDP:Triton Data Path(数据路径)
  TSC:Triton System Controller(系统控制器)
  QPA:Quad Port Acceleration(四接口加速)
  
  主板技术
  Gigabyte
  ACOPS:Automatic CPU OverHeat Prevention System(CPU过热预防系统)
  SIV:System Information Viewer(系统信息观察)
  磐英
  ESDJ(Easy Setting Dual Jumper,简化CPU双重跳线法)
  浩鑫
  UPT(USB、PANEL、LINK、TV-OUT四重接口)
  华硕
  C。O。P(CPU overheating protection,处理器过热保护)
  
  3、显示设备
  AD(Analog to Digitalg,模拟到数字转换)
  ADC(Apple Display Connector,苹果专用显示器接口)
  ASIC(Application Specific Integrated Circuit,特殊应用积体电路)
  ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
  ASC(Anti Static Coatings,防静电涂层)
  ASD(Auto Stereoscopic Display,自动立体显示)
  AGC(Anti Glare Coatings,防眩光涂层)
  AG(Aperture Grills,栅条式金属板)
  ARC(Anti Reflect Coating,防反射涂层)
  BLA:Bearn Landing Area(电子束落区)
  BMC(Black Matrix Screen,超黑矩阵屏幕)
  CCS(Cross Capacitance Sensing,交叉电容感应)
  cd/m^2(candela/平方米,亮度的单位)
  CDRS(Curved Directional Reflection Screen,曲线方向反射屏幕)
  CG-Silicon(Continuous Grain Silicon,连续微粒硅)
  CNT(carbon nano-tube,碳微管)
  CRC(Cyclical Redundancy Check,循环冗余检查)
  CRT(Cathode Ray Tube,阴极射线管)
  CVS(Compute Visual Syndrome,计算机视觉综合症)
  DA(Digital to Analog,数字到模拟转换)
  DDC(Display Data Channel,显示数据通道)
  DDWG(Digital Display Working Group,数字化显示工作组)
  DEC(Direct Etching Coatings,表面蚀刻涂层)
  Deflection Coil(偏转线圈)
  DFL(Dynamic Focus Lens,动态聚焦)
  DFP(Digital Flat Panel,数字平面显示标准)
  DFPG(Digital Flat Panel Group,数字平面显示标准工作组)
  DFS(Digital Flex Scan,数字伸缩扫描)
  DIC:Digital Image Control(数字图像控制)
  Digital Multiscan II(数字式智能多频追踪)
  DLP(digital Light Processing,数字光处理)
  DOSD:Digital On Screen Display(同屏数字化显示)
  DPMS(Display Power Management Signalling,显示能源管理信号)
  Dot Pitch(点距)
  DQL(Dynamic Quadrapole Lens,动态四极镜)
  DSP(Digital Signal Processing,数字信号处理)
  DSTN(Double layers Super Twisted Nematic,双层超扭曲向列,无源矩阵LCD)
  DTV(Digital TV,数字电视)
  DVI(Digital Visual Interface,数字化视像接口)
  ECD(ElectroChromic Display,电铬显示器)
  EFEAL(Extended Field Elliptical Aperture Lens,可扩展扫描椭圆孔镜头)
  FED(Field Emission Displays,电场显示器)
  Flyback Transformer(回转变压器)
  FPD(flat panel display,平面显示器)
  FRC:Frame Rate Control(帧比率控制)
  GLV(grating-light-valve,光栅亮度阀)
  HDMI(High Definition Multimedia Interface,高精度多媒体接口)
  HDTV(high definition television,高清晰度电视)
  HVD(High Voltage Differential,高分差动)
  IFT(Infinite FlatTube,无限平面管,三星丹娜)
  INVAR(不胀铜)
  IPS(in-plane switching,平面开关)
  LCD(liquid crystal display,液晶显示屏)
  LCOS:Liquid Crystal On Silicon(硅上液晶)
  LED(light emitting diode,光学二级管)
  L-SAGIC(Low Power-Small Aperture G1 wiht Impregnated Cathode,低电压光圈阴极
  管)
  LTPS(Low-Temperature Poly-Si,低温多晶硅)
  LVD(Low Voltage Differential,低分差动)
  LVDS(Low Voltage Differential Signal,低分差动信号)
  LRTC(LCD Response Time Compensation,液晶响应时间补偿)
  LTPS(Low Temperature Polysilicon,低温多硅显示器)
  MALS(Multi Astigmatism Lens System,多重散光聚焦系统)
  MDA(Monochrome Adapter,单色设备)
  Monochrome Monitor(单色显示器)
  MS:Magnetic Sensors(磁场感应器)
  MVA(multi-domain vertical alignment,广域垂直液晶队列)
  OEL(organic electro-luminescent,有机电镀冷光)
  OLED(Organic light-emitting diode,有机电激发光显示器)
  OSD(On Screen Display,同屏显示)
  PAC(psycho-acoustic compensation,心理声学补偿)
  P&D(Plug and Display,即插即显)
  PDP(Plasma Display Panel,等离子显示器)
  Porous Tungsten(活性钨)
  PPI(Pixel Per Inch,像素/英寸)
  RGB(Red、Blue、Green,红、蓝、绿三原色)
  ROP(raster operations,光栅操作)
  RSDS:Reduced Swing Differential Signal(小幅度摆动差动信号)
  SC(Screen Coatings,屏幕涂层)
  Single Ended(单终结)
  Shadow Mask(点状阴罩)
  SXGA(Super eXtended Graphics Array,超级扩展型图形阵列)
  STN(Super Twisted Nematic,超扭曲向列,无源矩阵)
  TCO(The Swedish Confederation of Professional Employees,瑞典专业工作人员联合会)
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